| Manufacturer Product Number |
XC7Z030-L2FBG484I |
| Packaging |
Tray |
| Operating Temperature |
-40°C ~ 100°C (TJ) |
| Part Status |
Active |
| Package / Case |
484-BBGA, FCBGA |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| REACH Status |
REACH Unaffected |
| ECCN |
3A991D |
| HTSUS |
8542.31.0070 |
| Environmental Information |
Xilinx REACH [ https://www.xilinx.com/content/dam/xilinx/publications/prod_mktg/quality/certificates/reach-position-statement.pdf ] |
| Series |
Zynq®-7000 |
| Base Product Number |
XC7Z030 |
| Datasheets 2 |
Zynq-7000 User Guide [ https://docs.amd.com/v/u/en-US/ug933-Zynq-7000-PCB ] |
| Featured Product |
All Programmable Zynq®-7000 SoC [ https://www.digikey.com/en/product-highlight/x/xilinx/zynq-7-soc ] |
| Manufacturer Standard Lead Time |
52 Weeks |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Supplier Device Package |
484-FCBGA (23x23) |
| PCN Design/Specification |
All product New AMD Logo 13/May/2024 [ https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/6253/PCN_XCN24003.pdf ] |
| Datasheets 3 |
XC7Z030,35,45,100 Datasheet [ https://docs.amd.com/v/u/en-US/ds191-XC7Z030-XC7Z045-data-sheet ] |
| PCN Design/Specification 2 |
Mult Dev Material Chg 16/Dec/2019 [ https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/191/XCN19005%28v1.2%29.pdf ] |
| Architecture |
MCU, FPGA |
| Speed |
800MHz |
| Primary Attributes |
Kintexâ„¢-7 FPGA, 125K Logic Cells |
| RAM Size |
256KB |
| Number of I/O |
130 |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |