| Manufacturer Product Number |
XCZU9EG-3FFVB1156E |
| Packaging |
Tray |
| Operating Temperature |
0°C ~ 100°C (TJ) |
| Part Status |
Active |
| Package / Case |
1156-BBGA, FCBGA |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| REACH Status |
REACH Unaffected |
| ECCN |
5A002A4 XIL |
| HTSUS |
8542.31.0070 |
| Environmental Information |
Xilinx REACH [ https://www.xilinx.com/content/dam/xilinx/publications/prod_mktg/quality/certificates/reach-position-statement.pdf ] |
| Series |
Zynq® UltraScale+™ MPSOC EG |
| Base Product Number |
XCZU9 |
| Datasheets 2 |
Zynq UltraScale+ [ https://docs.amd.com/v/u/en-US/ug1075-zynq-ultrascale-pkg-pinout ] |
| Featured Product |
Zynq® Ultrascale+™ MPSoC ZCU102 Evaluation Kit [ https://www.digikey.com/en/product-highlight/x/xilinx/zynq-ultrascale-mpsoc-zcu102-evaluation-kit ] |
| Manufacturer Standard Lead Time |
52 Weeks |
| Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Supplier Device Package |
1156-FCBGA (35x35) |
| PCN Design/Specification |
All product New AMD Logo 13/May/2024 [ https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/6253/PCN_XCN24003.pdf ] |
| Datasheets 3 |
Zynqâ„¢ UltraScale+â„¢ MPSoC Datasheet [ https://docs.amd.com/v/u/en-US/ds891-zynq-ultrascale-plus-overview ] |
| Architecture |
MCU, FPGA |
| Speed |
600MHz, 1.5GHz |
| Primary Attributes |
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| RAM Size |
256KB |
| Number of I/O |
328 |
| Peripherals |
DMA, WDT |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |